High-temperature FFKM O-ring for semiconductor is a high-performance sealing solution specifically designed for the semiconductor industry.
FFKM O-rings are high purity and extremely resistant to plasma, heat and harsh chemicals, which can extend the life of the seal, reduce contamination, increase wafer yield and reduce production costs.
About High-Temperature FFKM O-Ring For Semiconductor
High-temperature FFKM O-ring for semiconductor is a high-performance sealing solution specifically designed for the semiconductor industry. FFKM O-rings are high purity and extremely resistant to plasma, heat and harsh chemicals, which can extend the life of the seal, reduce contamination, increase wafer yield and reduce production costs.
Sealing Solutions for Semiconductor Equipment (Wet Process)
Wet Process
The semiconductor wet process involves a wide variety of chemical media and complex application scenarios, while also requiring careful cost considerations.
Hao-o Sealing provides a range of products for static, dynamic, and composite sealing applications thatoffer broad chemical resistance.
Our solutions are applied in various processes suchas wet etching, CMP (Chemical Mechanical Polishing), and photoresist coating & development.
| FFKM | ||||
| Process Category | Process | Tempera--ture | OperatingConditions | Materials |
| Wet Processes | Wafer Prep | 25~125°C | SC1, SC2, SPM, HF, UPDI | PF75WX00 PF75WX20 PF75KX20 |
| CMP | 25~100°C | KOH, NH3, UPDI | ||
| Photolithography | 25~125°C | TMAH, NaOH, H2SO4+Oxidant,Organic acids,NMP,Amines | ||
| Stripping | 25~125°C | NMP,MEA,HDMS,DMSO | ||
| Cleaning/Etching | 25~180°C | HCI,HNO3,H3PO4,HF,UPDI,SC1,SC2,O3 | ||
| Copper Plating | 25~100°C | CuSO4,H2SO4,H2O2 | ||
Key Features of High-Temperature FFKM O-Ring For Semiconductor
1. Wide Temperature Range: FFKM O-Rings can operate in extreme temperatures, typically ranging from -51°F to 620°F (-46°C to 327°C), with some formulations able to withstand temperatures as high as 300°C. This makes them suitable for applications involving significant thermal fluctuations.
2. Chemical Compatibility: FFKM O-Rings have excellent resistance to nearly all chemicals, with the ability to withstand more than 1,800 different chemicals. This makes them an excellent performer in semiconductor manufacturing processes, especially in highly corrosive chemical processing and etching processes.
3. Low Outgassing and Purity: FFKM materials are known for their low outgassing properties, which is critical in semiconductor manufacturing, as any tiny impurity can ruin a chip batch. They also maintain high purity levels, minimizing the risk of introducing impurities into sensitive processes.
4. Dimensional Stability: FFKM O-Rings maintain their shape and size under extreme conditions, ensuring long-term, reliable sealing performance.
5. Mechanical Properties: These O-Rings have excellent mechanical strength and resilience, allowing them to perform effectively in both static and dynamic applications. They can handle vacuum conditions and provide low friction, which is great for moving parts.
Sealing Solutions for Semiconductor Equipment (Thermal Process)
Thermal Process
Hao-o Sealing products featureoutstanding temperature resistance, outgassing performance inhigh-temperature processes such as LPCVD, oxidation, diffusion, and RTP.
Our Products meeting customer requirements for high-performance rubber materials in extreme thermalconditions.
| FFKM | ||||
| Process Category | Process | Tempera--ture | OperatingConditions | Materials |
| Thermal Processes | SACVD | 25~300°C | TEP,TEBO,TEOS,NF3,NH3,O3,O2,N2 | PF75WX40 PH75WX00 PH75TX00 |
| Metal CVD&ALD LPCVD | 25~300°C | Organic precursors, WF6,SiH6,TMA,DMAH,TiCl4,SiH4,HF,Cl2,SiH2Cl3,ClF3,NF3,H2O Vapour,O2,O3 | ||
| Lampanneader RTP | 150~300°C | IR radiaion,O2,Steam | ||
| Oxidationdiffusion | 150~300°C | N2,O2,H2O,HCI,CI2,B2H6,PH3,BBr3,POCI3 | ||
| UV cure | 150~300°C | N2,O2,O3,Ar | ||
| Thermal-ALD | 150~300°C | TEOS,SiH4,NH3,SiF4,CF4,NF3 | ||
Benefits of Using FFKM O-Rings
1. Enhanced Reliability: The durability of FFKM O-Rings results in longer service life, which reduces maintenance needs and equipment downtime. This reliability can translate into long-term cost savings.
2. Improved Product Quality: By minimizing process contamination, these O-Rings help improve product yield and quality, which is critical in semiconductor manufacturing where precision is critical.
3. Cost Effectiveness: While FFKM may have a higher initial cost compared to other elastomers, its long service life and low maintenance requirements can often reduce total operating costs.
Applications in Semiconductor Manufacturing
FFKM O-Rings are used in a variety of critical processes in the semiconductor industry, including:
1. Chemical Vapor Deposition (CVD).
2. Etching (wet and dry).
3. Chemical Mechanical Polishing (CMP).
4. Resist Stripping.
5. Plasma and Gas Deposition.
These applications highlight the versatility of FFKM O-Rings in environments that demand high performance and reliability.
